Intel’s Game-Changing Move: Glass Substrates to Pack 30 Trillion Transistors into a Single Chip
Revolutionizing Chip Manufacturing for Faster CPUs and Unprecedented Performance
In a groundbreaking hardware announcement made at Intel Innovation 2023, Intel revealed its visionary plan to incorporate glass into its manufacturing process by the end of the decade. This innovation, known as ‘glass core substrate technology,’ will supplant the current organic resin foundation, enabling Intel to accommodate a staggering 30 trillion transistors on a single chip.
The adoption of glass will grant Intel a remarkable 50% increase in chip area utilization. This expansion opens the door to fitting more CPU tiles within a single package. In conjunction with advancements like 3D stacking, Intel is poised to usher in an era where chips house an astonishing 30 trillion transistors on a glass substrate. This development translates into even faster CPUs, particularly tailored for high-performance computing and data centers. It also reaffirms the industry’s commitment to Moore’s Law, a prediction that foresees the doubling of transistors on a chip every few years.