Today, Qualcomm announced the expansion of its S3 Gen 2 Sound platform, targeting gamers with a new chip designed for dongles and adapters. The latest addition to the platform promises sub-20ms latency, providing an optimal gaming experience, while also introducing an additional backchannel for seamless voice chat.
The expanded Qualcomm S3 Gen 2 Sound combines the power of Snapdragon Sound and LE Audio, offering ultra-low latency of under 20ms for lag-free wireless audio with a voice backchannel dedicated to in-game communication. Notably, the chip further reduces latency when voice chat is not required, ensuring a smooth and uninterrupted delivery of game audio. Moreover, Qualcomm representatives have revealed to Engadget that the chip could potentially be compatible with wireless charging cases featuring audio-transmission capabilities, making it convenient for wireless listening during in-flight entertainment.
