A noteworthy design feature of the Core Ultra series is the adoption of a multi chiplet module (MCM) design, representing a substantial shift in Intel’s processor architecture. This innovative approach involves bonding two or more silicon slices, each housing the critical transistors that power computers (known as dies), at a microscopic level. This enables more flexible chip development compared to the traditional monolithic silicon slabs utilized by companies in the past.
Intel’s MCM design is reinforced by its Foveros packaging technology, the same technology that was employed in the Lakefield chip, although with more favorable outcomes anticipated this time. Despite Lakefield’s challenges, Intel is placing significant confidence in this technology to drive its future chip development.
