The MI300 boasts an impressive configuration, featuring 24 CPU Zen 4 cores (possibly a variant of the EPYC 9224), CDNA 3 GPU technology, and a groundbreaking 128GB HBM3. This processor is expected to be one of the first modern x86 chips to incorporate memory directly on the die, following in the footsteps of Apple’s Arm-based M1 and M2 chips. Consolidating all components onto a single silicon area leads to lower power consumption, improved performance, and reduced latency, and eliminates issues associated with traditional memory modules.
Dr. Lisa Su, AMD’s CEO, outlined the company’s mission to decrease the cost of data transfer between memory and computing with the unified memory architecture. The MI300 represents AMD’s first product to embody this philosophy, building on the groundwork laid by their Fusion APU in 2011. While the MI300 won’t be available for consumer PCs, AMD is primarily targeting the enterprise, database, and high-performance computing (HPC) markets, where the unique features of the MI300 will prove most beneficial.
