Next-Gen Computing: MiTAC and TYAN Launch Intel® Xeon® 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024

Next-Gen Computing: MiTAC and TYAN Launch Intel Xeon 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024

The relentless pace of technological evolution demands powerhouse platforms to match – a fact clearly not lost on MiTAC and its server brand TYAN. At COMPUTEX 2024, these vendors are pulling back the curtains on beastly new systems purposely bred to devour the hungriest AI, HPC, cloud, and enterprise workloads.

Ushering in the Intel Xeon 6 Era

Headlining the show are MiTAC and TYAN’s inaugural offerings integrating Intel’s latest Xeon 6 processors. This 6th gen silicon introduces new processor classes to meet the diverging needs of modern compute.

The Xeon 6700 “Efficient-core” chips pack a dense core count and sip power, tailored for throughput-hungry cloud-scale operations. Meanwhile, the “Performance-core” variants wield extreme memory bandwidth and I/O capability to excel across the broadest workload spectrum – with built-in AI accelerators further amplifying their computational might.

MiTAC is launching two potent dual-socket platforms to put this cutting-edge silicon through its paces. The 2U “Katmai Pass” system can accommodate up to four compute nodes and flexible air/liquid cooling configs, making it an HPC and AI juggernaut. The “Deer Creek Pass” full-featured design takes aim at data-intensive apps craving pure performance.

Not to be outdone, TYAN has a trio of Xeon 6 powerhouses prepped. The 4U “Thunder HX FT83B-B7149” dual-socket beast crams a staggering 32 DDR5 DIMM slots and 8 PCIe 5.0 x16 slots into its massively parallel frame. For on-prem edge deployments, the 1U “Thunder CX GC73A-B5660” packs 12 NVMe U.2 bays alongside OCP 3.0 expansion. And the “Tempest HX S5662” single-socket board delivers a standard GPU-dense design with PCIe 5.0 x16 flexibility.

Scalable Stalwarts for AI/HPC Dominance

But the Xeon 6 series isn’t the only heavy artillery being rolled out. MiTAC is also unveiling its first homegrown designs derived from Intel’s Data Center Solution Group (DSG), now operated under its guidance.

The DSG’s 4th and 5th Gen Xeon Scalable chips continue powering MiTAC’s “D50DNP” and “M50FCP” server families, upholding a legacy of extreme compute, acceleration, and I/O performance for AI/analytics and mainstream duties respectively.

TYAN too is flexing its Scalable silicon prowess with a vast barrage of systems. Standouts include the GPU-dense “Thunder HX FT65T-B5652” deskside AI rig, the ultra-dense 4-node “Thunder CX TD76-B5658” 2U enclosure, and an arsenal of storage-saturated 1U, 2U, and pedestal designs for every capacity and performance permutation.

Arming the Technological Vanguard

From groundbreaking Xeon 6 architectures to battle-proven Scalable tech, the new MiTAC and TYAN portfolios leave no compute conundrum unsolved as AI/ML, HPC, cloud, and edge paradigms intensify.

“For over a decade, we’ve worked with Intel at the vanguard of innovation – consistently delivering bleeding-edge solutions,” explained MiTAC’s Rick Hwang. “Our latest Intel-powered platforms transform computational capabilities while boosting efficiency and scaling operations.”