The US government has been actively promoting the growth of the semiconductor industry in the country, recognizing the importance of domestic chip production amid geopolitical tensions. While the government has allocated funding for chip manufacturing under the CHIPS Act, packaging facilities have received comparatively less investment. Building advanced packaging facilities is a costly endeavor, and TSMC currently has no plans to establish such facilities in the US. As a result, it is likely that packaging for advanced chips will continue to take place in Taiwan, highlighting the complexities of reshoring semiconductor production entirely.
