This development highlights the challenges of bringing semiconductor manufacturing and packaging entirely to the US. Despite efforts by the US government, including the CHIPS Act, which provides subsidies for chip factories, packaging facilities are still lacking in the country. Apple is not the only company affected by this limitation; other TSMC clients, including NVIDIA, AMD, and Tesla, may also need to send their chips to Taiwan for packaging. This situation could have broader implications for the tech industry’s efforts to reduce its reliance on overseas suppliers and improve supply chain resilience.
