Recognized in the Computer Hardware & Components category, Samsung’s 512GB CXL Memory Expander module will be the first memory device that supports the eagerly-awaited CXL 2.0 interface and will come in an EDSFF (E3.S) form factor ? especially suitable for next-generation high-capacity enterprise servers and data centres. This new memory module is built with an application-specific integrated circuit (ASIC) CXL controller, using DDR5 DRAM to support maximum bandwidth and capacity and for the first time, enabling memory to scale beyond tens of terabytes with the processing demands of big data and AI/ML workloads.
Samsung 16GB LPDDR5X and 1TB UFS 3.1 Multi-Chip Package – In the first integration of 14nm-based 16GB LPDDR5X DRAM and Samsung’s seventh-generation quad-level cell (QLC) V-NAND 1TB UFS (Universal Flash Storage) 3.1, this uMCP is providing a giant industry-leading leap forward. Honoured in the Embedded Technologies category, the integrated UFS-based multichip package is taking the industry toward higher-density, higher-speed and low-power memory for premium smartphones and other leading IT applications.
Samsung ISOCELL HP3 CMOS Image Sensor – As a state-of-the-art mobile sensor with a 1/1.4-inch optical format and 0.56?pixel size for slimmer camera designs, the Samsung ISOCELL HP3 was honoured in the Digital Imaging/Photography category. It features the smallest pixel technology in mobile cameras for greater design convenience and 200 megapixels that deliver the most detailed images available. The Tetra pixel technology allows the pixels to operate in a 1.12? or 2.24? size, capturing more light information in low light and taking 8K video with minimal loss in the field of view. Furthermore, using Super QPD technology, the ISOCELL HP3 can detect autofocus information horizontally and vertically.
Samsung W920+RF 6550 Next-gen Enhancement for Wearables – Recognized in the Wearable Technologies category, Samsung’s Exynos W920 System on a Chip (SoC) and Exynos RF 6550 connectivity solution is a next-generation tandem offering that adds a new dimension to wearable devices. The Exynos W920 processor, built on a 5-nanometer (nm) Extreme Ultra-Violet (EUV) process node, includes an LTE modem and provides the performance demanded by next-generation wearable devices with a powerful GPU and dual-core CPU. The companion RF 6550 chip, built on a 28nm process, integrates Wi-Fi, Bluetooth and GNSS connectivity with the utmost reliability into the Exynos W920 design.
