Qualcomm Launches Next-Generation Qualcomm Snapdragon 845 Mobile Platform

Qualcomm Launches Next-Generation Qualcomm Snapdragon 845 Mobile Platform

Alex Katouzian, senior vice president and general manager of mobile for Qualcomm Technologies unveiled Qualcomm Technologies’ next generation flagship mobile technology – the Snapdragon 845 Mobile Platform. The full unveiling of all the Snapdragon 845 Mobile Platform features and specs will take place tomorrow, Wednesday, December 6. ES Jung, president and general manager of the foundry business, Samsung Electronics, to confirm Samsung Foundry will be the foundry for Snapdragon 845 as the Companies continue to work together to advance the silicon manufacturing process. Xiaomi Founder, Chairman and Chief Executive Officer, Lei Jun. Mr. Lei emphasized Xiaomi’s close relationship with Qualcomm Technologies in the premium tier and announced that Xiaomi’s next flagship smartphone will be powered by Snapdragon 845.

Qualcomm Launches Next-Generation Qualcomm Snapdragon 845 Mobile Platform


Gigabit speeds : Cellular speeds at 1.2 gigabits per second
Secure Processing Unit (SPU) : Vault-like security for your data
New architecture : Power efficiency by up to 30 percent
Qualcomm Quick Charge : 50 percent of a full charge in just 15 minutes
Capturing 64 times more shades of color information
AI: three times the performance compared to the 835 with lower latency improved privacy and better reliability


The Snapdragon 845 Mobile Platform features include:

Qualcomm Spectra 280 ISP

-Ultra HD premium capture

-Qualcomm Spectra Module Program, featuring Active Depth Sensing
-MCTF video capture

-Multi-frame noise reduction

-High performance capture up to 16MP @60FPS

-Slow motion video capture (720p @480 fps)

-ImMotion computational photography

Adreno 630 Visual Processing Subsystem

-30% improved graphics/video rendering and power reduction compared to the previous generation

-Room-scale 6 DoF with SLAM

-Adreno foveation, featuring tile rendering, eye tracking, multiView rendering, fine grain preemption
-2K x 2K @ 120Hz, for 2.5x faster display throughput

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-Improved 6DoF with hand-tracking and controller support

Qualcomm® Hexagon™ 685 DSP

-3rd Generation Hexagon Vector DSP (HVX) for AI and imaging

-3rd Generation Qualcomm All-Ways AwareTM Sensor Hub

– Hexagon scalar DSP for audio

Snapdragon X20 LTE Modem

– Support for 1.2 Gbps Gigabit LTE Category 18

– License Assisted Access (LAA)

– Citizens Broadband Radio Service (CBRS) shared radio spectrum

– Dual SIM-Dual VoLTE (DSDV)


  • Multigigabit 11ad Wi-Fi with diversity module
  • Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
  • 11k/r/v: Carrier Wi-Fi enhanced mobility, fast acquisition, and congestion mitigation
  • Bluetooth 5 with proprietary enhancements for ultra-low power wireless earbud support and direct audio broadcast to multiple devices

Secure Processing Unit

– Biometric authentication (fingerprint, iris, voice, face)

– User and app data protection

– Integrated use-cases such as integrated SIM, Payments, and more

Qualcomm Aqstic Audio

  • Qualcomm Aqstic audio codec(WCD934x):


  • Dynamic range: 130dB, THD+N: -109dB
  • Native DSD support (DSD64/DSD128), PCM up to 384kHz/32bit
  • Low power voice activation: 0.65mA


  • Dynamic range: 109dB, THD+N: -103dB
  • Sampling: Up to 192kHz/24bit

Qualcomm® Quick Charge™ 4+

Kryo 385 CPU

-Four performance cores up to 2.8GHz (25 percent performance uplift compared to the previous generation)

– Four efficiency cores up to 1.8GHz

-2MB shared L3 cache (new)

-3MB system cache (new)

10-nanometer (nm) LPP FinFET process technology

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