Designed for pluggable OSFP modules, the monolithically integrated lasers and modulators improve system integration with wafer-level laser alignment and integrated direct modulation. This additional advantage of all-optics innovation in the transceiver chip design results in accelerated OEM manufacturing yield maturity and time to market for transceiver module delivery.
“As data centers worldwide strive to accelerate infrastructure improvements that enhance AI workload performance, the entire value chain is seeking progressive solutions that deliver faster and more energy efficient data processing.” said Doron Tal, senior vice president and general manager of Optical Connectivity. “The NPG102 TOC for 1.6Tbps DSP-based modules joins our NPG102 chip for LPO on our all-optics innovation roadmap of generational of solutions allowing us to serve the needs of both DSP-based pluggable and LPO-based pluggable optics segments and put data centers on a path in this decade to deliver higher capacity, low power optical connectivity.”
