Intel has officially confirmed its commencement of using glass core substrates in packaging by the end of the decade. This move is poised to reshape the landscape of chip manufacturing, and it would be no surprise if the rest of the industry swiftly follows suit.
Intel’s Game-Changing Move: Glass Substrates to Pack 30 Trillion Transistors into a Single Chip
Revolutionizing Chip Manufacturing for Faster CPUs and Unprecedented Performance
