The company closed its webcast by confirming more details on its Intel InnovatiON event. Intel InnovatiON will be held in San Francisco and online on Oct. 27-28, 2021.
The image at left shows a design with power and signal wires intermingled on the top of the wafer. The image at right shows the new PowerVia technology, Intel’s unique industry-first implementation of a backside power delivery network. PowerVia was introduced at the "Intel Accelerated" event on July 26, 2021. At the event, Intel presented the company's future process and packaging technology roadmaps. (Credit: Intel Corporation)
