Infrastructure giant Vertiv is snapping up Italian heat rejection specialist ThermoKey to bolster its thermal management offerings amid surging AI-driven demand.
Infrastructure giant Vertiv is expanding its thermal management portfolio with the acquisition of Italian heat exchanger specialist ThermoKey.
Infrastructure giant Vertiv is snapping up Italian heat rejection specialist ThermoKey as demand for AI-ready data center cooling solutions intensifies.
Rival storage giants Samsung and SanDisk are set to integrate HBF technology into AI products from industry leaders like Nvidia, AMD, and Google. This move toward Host-Based Flash (HBF) marks a massive shift in how high-performance storage will handle the intense data demands of the artificial intelligence era.
AMD has revealed its next-generation AI hardware roadmap, with the Instinct MI500 series set for 2027, potentially leaving a gap as Nvidia prepares its Vera-Rubin platform for 2026.
Airloom Energy is demonstrating a wind power system at CES 2026 that uses vertical wings moving along an oval track instead of traditional tower-mounted blades. The company claims the design reduces costs by approximately 50 percent while maintaining equivalent power output, with a pilot site in Wyoming testing the technology for commercial deployment.
Ford is shifting its strategy by repurposing idle electric vehicle battery capacity to support the growing energy needs of AI data centers and the electrical grid.
Toshiba is mapping out a future for high capacity storage, with plans to release a 40TB hard drive next year and hit the 55TB mark by the end of the decade.
